We perform 100% AOI on every board to determine correct component placement, polarity, and identification of any solder defects. Our AOI capabilities allow flexibility and capacity needed to handle all challenges. Our technicians continually optimize the programs to improve inspection quality.

CRI’s X-Ray capabilities allow for inspection of bottom-terminated components, including BGAs, in order to verify solder joints meet industry and customer requirements.

Our flight trained and certified inspectors will visually inspect to your classifications. Products will not leave the facility until they meet all customer and industry requirements.

CRI can perform functional testing of your product based on your requirements, at both the PCBA and Box Level.